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    Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field

    New search for: Kawai, E.
    New search for: Sanada, K.
    New search for: Sumigawa, T.
    New search for: Kitamura, T.

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    Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field

    New search for: Kawai, E.
    New search for: Sanada, K.
    New search for: Sumigawa, T.
    New search for: Kitamura, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field

    New search for: Kawai, E.
    New search for: Sanada, K.
    New search for: Sumigawa, T.
    New search for: Kitamura, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field

    Contributors:

    Kawai, E. (author) / Sanada, K. (author) / Sumigawa, T. (author) / Kitamura, T. (author)

    Published in:

    ENGINEERING FRACTURE MECHANICS ; 120 ; 60-66

    Publication date:

    2014-01-01

    Size:

    7 pages

    ISSN:

    0013-7944

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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