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In situ monitoring of the strain evolution and curing reaction of composite laminates to reduce the thermal residual stress using FBG sensor and dielectrometry
In situ monitoring of the strain evolution and curing reaction of composite laminates to reduce the thermal residual stress using FBG sensor and dielectrometry
In situ monitoring of the strain evolution and curing reaction of composite laminates to reduce the thermal residual stress using FBG sensor and dielectrometry
Kim, H.-S. (author) / Yoo, S.-H. (author) / Chang, S.-H. (author)
COMPOSITES PART B ; 44 ; 446-452
2013-01-01
7 pages
Article (Journal)
English
DDC:
620.118
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