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Layer-plus-wire growth of copper by small incident angle deposition

Su, J. B. / Li, X. X. / Jiang, M. P. / Wang, H. H.

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Layer-plus-wire growth of copper by small incident angle deposition

Su, J. B. / Li, X. X. / Jiang, M. P. / Wang, H. H.

Layer-plus-wire growth of copper by small incident angle deposition

Su, J. B. / Li, X. X. / Jiang, M. P. / Wang, H. H.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Layer-plus-wire growth of copper by small incident angle deposition

Contributors:

Su, J. B. (author) / Li, X. X. (author) / Jiang, M. P. (author) / Wang, H. H. (author)

Published in:

MATERIALS LETTERS ; 92 ; 304-307

Publication date:

2013-01-01

Size:

4 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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