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    Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation

    New search for: Ogura, T.
    New search for: Nishimura, M.
    New search for: Tatsumi, H.
    New search for: Takahara, W.
    New search for: Hirose, A.

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    Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation

    New search for: Ogura, T.
    New search for: Nishimura, M.
    New search for: Tatsumi, H.
    New search for: Takahara, W.
    New search for: Hirose, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation

    New search for: Ogura, T.
    New search for: Nishimura, M.
    New search for: Tatsumi, H.
    New search for: Takahara, W.
    New search for: Hirose, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Interfacial Bonding Behavior between Silver Nanoparticles and Gold Substrate Using Molecular Dynamics Simulation

    Contributors:

    Ogura, T. (author) / Nishimura, M. (author) / Tatsumi, H. (author) / Takahara, W. (author) / Hirose, A. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 53 ; 2085-2090

    Publication date:

    2012-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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