A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
A Short History of Flip Chip and Wafer Level Packaging
A Short History of Flip Chip and Wafer Level Packaging
A Short History of Flip Chip and Wafer Level Packaging
Elenius, P. (author)
ADVANCING MICROELECTRONICS ; 40 ; 6-9
2013-01-01
4 pages
Article (Journal)
English
DDC:
621.381
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
On the Origins, Status, and Future of Flip Chip and Wafer Level Packaging
| British Library Online Contents | 2011
Wafer Level Chip Scale Packaging (WLCSP)
British Library Online Contents | 2008
Evolution of Organic Flip Chip Packaging
| British Library Online Contents | 2005
Wafer-level Microbumping for Flip Chips
| British Library Online Contents | 2005
Wafer-level Packaging Perspectives
| British Library Online Contents | 2002