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    Rheological characterization of a novel isotropic conductive adhesive - Epoxy filled with metal-coated polymer spheres

    New search for: Nguyen, H. V.
    New search for: Andreassen, E.
    New search for: Kristiansen, H.
    New search for: Johannessen, R.
    New search for: Hoivik, N.
    New search for: Aasmundtveit, K. E.

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    Rheological characterization of a novel isotropic conductive adhesive - Epoxy filled with metal-coated polymer spheres

    New search for: Nguyen, H. V.
    New search for: Andreassen, E.
    New search for: Kristiansen, H.
    New search for: Johannessen, R.
    New search for: Hoivik, N.
    New search for: Aasmundtveit, K. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Rheological characterization of a novel isotropic conductive adhesive - Epoxy filled with metal-coated polymer spheres

    New search for: Nguyen, H. V.
    New search for: Andreassen, E.
    New search for: Kristiansen, H.
    New search for: Johannessen, R.
    New search for: Hoivik, N.
    New search for: Aasmundtveit, K. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Rheological characterization of a novel isotropic conductive adhesive - Epoxy filled with metal-coated polymer spheres

    Contributors:

    Nguyen, H. V. (author) / Andreassen, E. (author) / Kristiansen, H. (author) / Johannessen, R. (author) / Hoivik, N. (author) / Aasmundtveit, K. E. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 46 ; 784-793

    Publication date:

    2013-01-01

    Size:

    10 pages

    ISSN:

    0261-3069

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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