Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Rheological characterization of a novel isotropic conductive adhesive - Epoxy filled with metal-coated polymer spheres
Rheological characterization of a novel isotropic conductive adhesive - Epoxy filled with metal-coated polymer spheres
Rheological characterization of a novel isotropic conductive adhesive - Epoxy filled with metal-coated polymer spheres
Nguyen, H. V. (Autor:in) / Andreassen, E. (Autor:in) / Kristiansen, H. (Autor:in) / Johannessen, R. (Autor:in) / Hoivik, N. (Autor:in) / Aasmundtveit, K. E. (Autor:in)
MATERIALS AND DESIGN -REIGATE- ; 46 ; 784-793
01.01.2013
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
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