Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties: Fid-Bau Portal

Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties

Song, X. G. / Cao, J. / Chen, H. Y. / Wang, H. Q. / Feng, J. C.

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Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties

Song, X. G. / Cao, J. / Chen, H. Y. / Wang, H. Q. / Feng, J. C.

Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties

Song, X. G. / Cao, J. / Chen, H. Y. / Wang, H. Q. / Feng, J. C.

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Access via TIB

Check availability in my library

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Document information

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Document information

Title:

Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties

Contributors:

Song, X. G. (author) / Cao, J. (author) / Chen, H. Y. (author) / Wang, H. Q. (author) / Feng, J. C. (author)

Published in:

MATERIALS AND DESIGN -REIGATE- ; 46 ; 895-901

Publication date:

2013-01-01

Size:

7 pages

ISSN:

0261-3069

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.0042

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