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Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties
Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties
Contact reactive brazing of Ti53311S alloy using Cu foil as interlayer: Interfacial microstructure and joining properties
Song, X. G. (Autor:in) / Cao, J. (Autor:in) / Chen, H. Y. (Autor:in) / Wang, H. Q. (Autor:in) / Feng, J. C. (Autor:in)
MATERIALS AND DESIGN -REIGATE- ; 46 ; 895-901
01.01.2013
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
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