Interfacial Stress Intensity Factors for Edge-Cracked Bonded Semicircles and Strips Under Out-of-Plane Shear: Fid-Bau Portal

Interfacial Stress Intensity Factors for Edge-Cracked Bonded Semicircles and Strips Under Out-of-Plane Shear

Chen, C. H. / Ke, C. C. / Wang, C. L.

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Interfacial Stress Intensity Factors for Edge-Cracked Bonded Semicircles and Strips Under Out-of-Plane Shear

Chen, C. H. / Ke, C. C. / Wang, C. L.

Interfacial Stress Intensity Factors for Edge-Cracked Bonded Semicircles and Strips Under Out-of-Plane Shear

Chen, C. H. / Ke, C. C. / Wang, C. L.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Interfacial Stress Intensity Factors for Edge-Cracked Bonded Semicircles and Strips Under Out-of-Plane Shear

Contributors:

Chen, C. H. (author) / Ke, C. C. (author) / Wang, C. L. (author)

Published in:

INTERNATIONAL JOURNAL OF FRACTURE ; 180 ; 119-127

Publication date:

2013-01-01

Size:

9 pages

ISSN:

0376-9429

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1126

Fett, T. | British Library Online Contents | 1999

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