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    Development of SiC Super-Junction (SJ) Device by Deep Trench-Filling Epitaxial Growth

    New search for: Kosugi, R.
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    Development of SiC Super-Junction (SJ) Device by Deep Trench-Filling Epitaxial Growth

    New search for: Kosugi, R.
    New search for: Sakuma, Y.
    New search for: Kojima, K.
    New search for: Itoh, S.
    New search for: Nagata, A.
    New search for: Yatsuo, T.
    New search for: Tanaka, Y.
    New search for: Okumura, H.
    New search for: Lebedev, A.A.
    New search for: Davydov, S.Y.
    New search for: Ivanov, P.A.
    New search for: Levinshtein, M.E.

    Access

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    Development of SiC Super-Junction (SJ) Device by Deep Trench-Filling Epitaxial Growth

    New search for: Kosugi, R.
    New search for: Sakuma, Y.
    New search for: Kojima, K.
    New search for: Itoh, S.
    New search for: Nagata, A.
    New search for: Yatsuo, T.
    New search for: Tanaka, Y.
    New search for: Okumura, H.
    New search for: Lebedev, A.A.
    New search for: Davydov, S.Y.
    New search for: Ivanov, P.A.
    New search for: Levinshtein, M.E.

    Access

    Access via TIB
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    Document information
    Title:

    Development of SiC Super-Junction (SJ) Device by Deep Trench-Filling Epitaxial Growth

    Contributors:

    Kosugi, R. (author) / Sakuma, Y. (author) / Kojima, K. (author) / Itoh, S. (author) / Nagata, A. (author) / Yatsuo, T. (author) / Tanaka, Y. (author) / Okumura, H. (author) / Lebedev, A.A. / Davydov, S.Y.

    Published in:

    Silicon Carbide and Related Materials 2012 Selected, peer reviewed papers from the 9th European Conference on Silicon Carbide and Related Materials (ECSCRM 2012), September 2-6, 2012, St. Petersburg, Russian Federation ; 785-788

    MATERIALS SCIENCE FORUM ; 740/742

    Publication date:

    2013-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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