Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating: Fid-Bau Portal

Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

Tseng, C. F. / Jill Lee, C. / Duh, J. G.

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Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

Tseng, C. F. / Jill Lee, C. / Duh, J. G.

Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

Tseng, C. F. / Jill Lee, C. / Duh, J. G.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

Contributors:

Tseng, C. F. (author) / Jill Lee, C. (author) / Duh, J. G. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 574 ; 60-67

Publication date:

2013-01-01

Size:

8 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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