Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders: Fid-Bau Portal

Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders

Hwang, C.-W. / Suganuma, K. / Kiso, M. / Hashimoto, S.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders

Hwang, C.-W. / Suganuma, K. / Kiso, M. / Hashimoto, S.

Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders

Hwang, C.-W. / Suganuma, K. / Kiso, M. / Hashimoto, S.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders

Contributors:

Hwang, C.-W. (author) / Suganuma, K. (author) / Kiso, M. (author) / Hashimoto, S. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 18 ; 2540-2543

Publication date:

2003-01-01

Size:

4 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Kikuchi, S. / Nishimura, M. / Suetsugu, K. et al. | British Library Online Contents | 2001

Lead-free Solders in Microelectronics

Abtew, M. / Selvaduray, G. | British Library Online Contents | 2000

Overview of Lead-Free Solders

Sigelko, J. D. / Subramanian, K. N. | British Library Online Contents | 2000

Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM

Kim, K.-S. / Yang, J.-M. / Yu, C.-H. et al. | British Library Online Contents | 2004

The Recrystallization of Microelectronic Lead-Free Solders

Hung, F.-Y. / Lui, T.-S. / Chen, L.-H. et al. | British Library Online Contents | 2008