A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Semisolid forging electronic packaging shell with silicon carbon-reinforced copper composites
Semisolid forging electronic packaging shell with silicon carbon-reinforced copper composites
Semisolid forging electronic packaging shell with silicon carbon-reinforced copper composites
Wang, K. K. (author)
RARE METALS -BEIJING- ENGLISH EDITION ; 32 ; 191-195
2013-01-01
5 pages
Article (Journal)
English
DDC:
669
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