Electrochemical Nucleation of Cyanide-free Alkaline Copper Plating from EDTA Bath: Fid-Bau Portal

Electrochemical Nucleation of Cyanide-free Alkaline Copper Plating from EDTA Bath

Zhao, Q. / Zhao, L. / Du, N.

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Electrochemical Nucleation of Cyanide-free Alkaline Copper Plating from EDTA Bath

Zhao, Q. / Zhao, L. / Du, N.

Electrochemical Nucleation of Cyanide-free Alkaline Copper Plating from EDTA Bath

Zhao, Q. / Zhao, L. / Du, N.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Electrochemical Nucleation of Cyanide-free Alkaline Copper Plating from EDTA Bath

Contributors:

Zhao, Q. (author) / Zhao, L. (author) / Du, N. (author)

Published in:

CORROSION AND PROTECTION -NANCHANG- ; 34 ; 220-222

Publication date:

2013-01-01

Size:

3 pages

ISSN:

1005-748X

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11223

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