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    Evolution of thermal property and creep resistance of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solders

    New search for: El-Daly, A. A.
    New search for: El-Taher, A. M.

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    Evolution of thermal property and creep resistance of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solders

    New search for: El-Daly, A. A.
    New search for: El-Taher, A. M.

    Access

    Access via TIB
    Check availability in my library
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    Evolution of thermal property and creep resistance of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solders

    New search for: El-Daly, A. A.
    New search for: El-Taher, A. M.

    Access

    Access via TIB
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    Document information
    Title:

    Evolution of thermal property and creep resistance of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solders

    Contributors:

    El-Daly, A. A. (author) / El-Taher, A. M. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 51 ; 789-796

    Publication date:

    2013-01-01

    Size:

    8 pages

    ISSN:

    0261-3069

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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