Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Evolution of thermal property and creep resistance of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solders
Evolution of thermal property and creep resistance of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solders
Evolution of thermal property and creep resistance of Ni and Zn-doped Sn-2.0Ag-0.5Cu lead-free solders
El-Daly, A. A. (Autor:in) / El-Taher, A. M. (Autor:in)
MATERIALS AND DESIGN -REIGATE- ; 51 ; 789-796
01.01.2013
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.0042
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