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Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni
Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni
Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni
Hammad, A.E. (author)
MATERIALS AND DESIGN -REIGATE- ; 50 ; 108-116
2013-01-01
9 pages
Article (Journal)
English
DDC:
620.0042
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British Library Online Contents | 2013
|British Library Online Contents | 2013
|British Library Online Contents | 2013
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