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    Finite Element Analysis of Failure in Cu Interconnect Megasonic Cleaning

    New search for: Huang, Y.T.
    New search for: Meng, C.L.
    New search for: Wu, N.P.
    New search for: Dong, X.P.
    New search for: Lu, X.C.
    New search for: Tang, F.

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    Finite Element Analysis of Failure in Cu Interconnect Megasonic Cleaning

    New search for: Huang, Y.T.
    New search for: Meng, C.L.
    New search for: Wu, N.P.
    New search for: Dong, X.P.
    New search for: Lu, X.C.
    New search for: Tang, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Finite Element Analysis of Failure in Cu Interconnect Megasonic Cleaning

    New search for: Huang, Y.T.
    New search for: Meng, C.L.
    New search for: Wu, N.P.
    New search for: Dong, X.P.
    New search for: Lu, X.C.
    New search for: Tang, F.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Finite Element Analysis of Failure in Cu Interconnect Megasonic Cleaning

    Contributors:

    Huang, Y.T. (author) / Meng, C.L. (author) / Wu, N.P. (author) / Dong, X.P. (author) / Lu, X.C. (author) / Tang, F.

    Published in:

    Micro-Nano Technology XIV ; 1471-1476

    KEY ENGINEERING MATERIALS ; 562/565

    Publication date:

    2013-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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