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    Effect of Electroplating Parameters on Bonding Strength of Lowered-Temperature Electroplated Iron Coating with Substrate

    New search for: Yang, S.
    New search for: Liu, J.
    New search for: Li, Y.-l.

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    Effect of Electroplating Parameters on Bonding Strength of Lowered-Temperature Electroplated Iron Coating with Substrate

    New search for: Yang, S.
    New search for: Liu, J.
    New search for: Li, Y.-l.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Electroplating Parameters on Bonding Strength of Lowered-Temperature Electroplated Iron Coating with Substrate

    New search for: Yang, S.
    New search for: Liu, J.
    New search for: Li, Y.-l.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Effect of Electroplating Parameters on Bonding Strength of Lowered-Temperature Electroplated Iron Coating with Substrate

    Contributors:

    Yang, S. (author) / Liu, J. (author) / Li, Y.-l. (author)

    Published in:

    MATERIALS PROTECTION -WUHAN- ; 46 ; 15-17

    Publication date:

    2013-01-01

    Size:

    3 pages

    ISSN:

    1001-1560

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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