Microstructure and mechanical properties of TC4/oxygen-free copper joint with silver interlayer prepared by diffusion bonding: Fid-Bau Portal

Microstructure and mechanical properties of TC4/oxygen-free copper joint with silver interlayer prepared by diffusion bonding

Shen, Q. / Xiang, H. / Luo, G. / Wang, C. / Li, M. / Zhang, L.

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Microstructure and mechanical properties of TC4/oxygen-free copper joint with silver interlayer prepared by diffusion bonding

Shen, Q. / Xiang, H. / Luo, G. / Wang, C. / Li, M. / Zhang, L.

Microstructure and mechanical properties of TC4/oxygen-free copper joint with silver interlayer prepared by diffusion bonding

Shen, Q. / Xiang, H. / Luo, G. / Wang, C. / Li, M. / Zhang, L.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Microstructure and mechanical properties of TC4/oxygen-free copper joint with silver interlayer prepared by diffusion bonding

Contributors:

Shen, Q. (author) / Xiang, H. (author) / Luo, G. (author) / Wang, C. (author) / Li, M. (author) / Zhang, L. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 596 ; 45-51

Publication date:

2014-01-01

Size:

7 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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