Modeling of Coupled Temperature-Displacement-Diffusion Problem for Silica-Phenolic Composite under High Temperature: Fid-Bau Portal

Modeling of Coupled Temperature-Displacement-Diffusion Problem for Silica-Phenolic Composite under High Temperature

Shi, S. / Liang, J.

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Modeling of Coupled Temperature-Displacement-Diffusion Problem for Silica-Phenolic Composite under High Temperature

Shi, S. / Liang, J.

Modeling of Coupled Temperature-Displacement-Diffusion Problem for Silica-Phenolic Composite under High Temperature

Shi, S. / Liang, J.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Modeling of Coupled Temperature-Displacement-Diffusion Problem for Silica-Phenolic Composite under High Temperature

Contributors:

Shi, S. (author) / Liang, J. (author)

Published in:

POLYMERS AND POLYMER COMPOSITES ; 22 ; 85-90

Publication date:

2014-01-01

Size:

6 pages

ISSN:

0967-3911

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.192

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