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Residual Stress Characterization of Electroformed Ni-Base Alloy for μ-Gear Mold
Residual Stress Characterization of Electroformed Ni-Base Alloy for μ-Gear Mold
Residual Stress Characterization of Electroformed Ni-Base Alloy for μ-Gear Mold
Son, S.H. (author) / Park, S.C. (author) / Kim, H.M. (author) / Lee, W.S. (author) / Lee, H.K. (author) / Tieu, A.K. / Zhu, H. / Zhu, Q.
2014-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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