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Cu-SiC~p Composites as Advanced Electronic Packaging Materials

Azmi, K. / Derman, M.N. / Bakri, A.M.M.A. / Sandu, A.V.

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Cu-SiC~p Composites as Advanced Electronic Packaging Materials

Azmi, K. / Derman, M.N. / Bakri, A.M.M.A. / Sandu, A.V.

Cu-SiC~p Composites as Advanced Electronic Packaging Materials

Azmi, K. / Derman, M.N. / Bakri, A.M.M.A. / Sandu, A.V.

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Order at Subito €

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Title:

Cu-SiC~p Composites as Advanced Electronic Packaging Materials

Contributors:

Azmi, K. (author) / Derman, M.N. (author) / Bakri, A.M.M.A. (author) / Sandu, A.V. (author) / Abdullah, M.M.A.B. / Jamaludin, L. / Abdullah, A. / Razak, R.A. / Hussin, K.

Published in:

Advanced Materials Engineering and Technology II ; 852-856

KEY ENGINEERING MATERIALS ; 594/595

Publication date:

2014-01-01

Size:

5 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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