A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Emerging challenges and materials for thermal management of electronics
Emerging challenges and materials for thermal management of electronics
Emerging challenges and materials for thermal management of electronics
Moore, A. L. (author) / Shi, L. (author)
MATERIALS TODAY -OXFORD THEN KIDLINGTON- ; 17 ; 163-174
2014-01-01
12 pages
Article (Journal)
English
DDC:
620.11299
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