Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Emerging challenges and materials for thermal management of electronics
Emerging challenges and materials for thermal management of electronics
Emerging challenges and materials for thermal management of electronics
Moore, A. L. (Autor:in) / Shi, L. (Autor:in)
MATERIALS TODAY -OXFORD THEN KIDLINGTON- ; 17 ; 163-174
01.01.2014
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11299
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