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Effect of grain boundary behaviour on ductility dip cracking mechanism

Chen, J.Q. / Lu, H. / Cui, W. / Chen, J.M. / Huang, Y.F.

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Effect of grain boundary behaviour on ductility dip cracking mechanism

Chen, J.Q. / Lu, H. / Cui, W. / Chen, J.M. / Huang, Y.F.

Effect of grain boundary behaviour on ductility dip cracking mechanism

Chen, J.Q. / Lu, H. / Cui, W. / Chen, J.M. / Huang, Y.F.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of grain boundary behaviour on ductility dip cracking mechanism

Contributors:

Chen, J.Q. (author) / Lu, H. (author) / Cui, W. (author) / Chen, J.M. (author) / Huang, Y.F. (author)

Published in:

MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 30 ; 1189-1196

Publication date:

2014-01-01

Size:

8 pages

ISSN:

0267-0836

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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