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Anomalous multiple pop-in behavior in Cu–Sn-based intermetallic compounds during nanoindentation

Jun, H. / Kim, Y. / Lee, S. / Kang, N. / Kim, K. B. / Kim, M. / Hyung Kim, S. / Lee, D.

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Anomalous multiple pop-in behavior in Cu–Sn-based intermetallic compounds during nanoindentation

Jun, H. / Kim, Y. / Lee, S. / Kang, N. / Kim, K. B. / Kim, M. / Hyung Kim, S. / Lee, D.

Anomalous multiple pop-in behavior in Cu–Sn-based intermetallic compounds during nanoindentation

Jun, H. / Kim, Y. / Lee, S. / Kang, N. / Kim, K. B. / Kim, M. / Hyung Kim, S. / Lee, D.

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Access via TIB

Check availability in my library

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Document information

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Document information

Title:

Anomalous multiple pop-in behavior in Cu–Sn-based intermetallic compounds during nanoindentation

Contributors:

Jun, H. (author) / Kim, Y. (author) / Lee, S. (author) / Kang, N. (author) / Kim, K. B. (author) / Kim, M. (author) / Hyung Kim, S. (author) / Lee, D. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 612 ; 192-196

Publication date:

2014-01-01

Size:

5 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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