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A platform for research: civil engineering, architecture and urbanism
A New Cutting Wire Prepared by Copper-Diamond Composite Electroplating
A New Cutting Wire Prepared by Copper-Diamond Composite Electroplating
A New Cutting Wire Prepared by Copper-Diamond Composite Electroplating
Wang, Z.Y. (author) / Zheng, J.W. (author) / Cai, W. (author) / Qiao, L. (author) / Ying, Y. (author) / Jiang, L.Q. (author) / Che, S.L. (author)
MATERIALS SCIENCE FORUM ; 788 ; 662-667
2014-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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