Experimental Investigation and Numerical Simulation of Pure Copper Foil Springback in Micro-Bending Process: Fid-Bau Portal

Experimental Investigation and Numerical Simulation of Pure Copper Foil Springback in Micro-Bending Process

Lin, X.J. / Wang, G.C. / Jiang, H. / Li, J.

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Experimental Investigation and Numerical Simulation of Pure Copper Foil Springback in Micro-Bending Process

Lin, X.J. / Wang, G.C. / Jiang, H. / Li, J.

Experimental Investigation and Numerical Simulation of Pure Copper Foil Springback in Micro-Bending Process

Lin, X.J. / Wang, G.C. / Jiang, H. / Li, J.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Experimental Investigation and Numerical Simulation of Pure Copper Foil Springback in Micro-Bending Process

Contributors:

Lin, X.J. (author) / Wang, G.C. (author) / Jiang, H. (author) / Li, J. (author)

Published in:

KEY ENGINEERING MATERIALS ; 609/610 ; 531-535

Publication date:

2014-01-01

Size:

5 pages

ISSN:

1013-9826

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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