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    Effects of indium addition on properties and wettability of Sn-0.7Cu-0.2Ni lead-free solders

    New search for: Li, L. F.
    New search for: Cheng, Y. K.
    New search for: Xu, G. L.
    New search for: Wang, E. Z.
    New search for: Zhang, Z. H.
    New search for: Wang, H.

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    Effects of indium addition on properties and wettability of Sn-0.7Cu-0.2Ni lead-free solders

    New search for: Li, L. F.
    New search for: Cheng, Y. K.
    New search for: Xu, G. L.
    New search for: Wang, E. Z.
    New search for: Zhang, Z. H.
    New search for: Wang, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of indium addition on properties and wettability of Sn-0.7Cu-0.2Ni lead-free solders

    New search for: Li, L. F.
    New search for: Cheng, Y. K.
    New search for: Xu, G. L.
    New search for: Wang, E. Z.
    New search for: Zhang, Z. H.
    New search for: Wang, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effects of indium addition on properties and wettability of Sn-0.7Cu-0.2Ni lead-free solders

    Contributors:

    Li, L. F. (author) / Cheng, Y. K. (author) / Xu, G. L. (author) / Wang, E. Z. (author) / Zhang, Z. H. (author) / Wang, H. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 64 ; 15-20

    Publication date:

    2014-01-01

    Size:

    6 pages

    ISSN:

    0261-3069

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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