A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Mechanical properties of sintered Ag-Cu die-attach nanopaste for application on SiC device
Mechanical properties of sintered Ag-Cu die-attach nanopaste for application on SiC device
Mechanical properties of sintered Ag-Cu die-attach nanopaste for application on SiC device
Tan, K. S. (author) / Cheong, K. Y. (author)
MATERIALS AND DESIGN -REIGATE- ; 64 ; 166-176
2014-01-01
11 pages
Article (Journal)
English
DDC:
620.0042
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