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Electrochemical deposition of nanodendritic Sn/Cu6Sn5 foam

Jeun, J. H. / Kim, W. S. / Hong, S. H.

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Electrochemical deposition of nanodendritic Sn/Cu6Sn5 foam

Jeun, J. H. / Kim, W. S. / Hong, S. H.

Electrochemical deposition of nanodendritic Sn/Cu6Sn5 foam

Jeun, J. H. / Kim, W. S. / Hong, S. H.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Electrochemical deposition of nanodendritic Sn/Cu6Sn5 foam

Contributors:

Jeun, J. H. (author) / Kim, W. S. (author) / Hong, S. H. (author)

Published in:

MATERIALS LETTERS ; 138 ; 33-36

Publication date:

2015-01-01

Size:

4 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation

Yu, J. J. / Wu, J. Y. / Yu, L. J. et al. | British Library Online Contents | 2017

First-principles calculations of Zn substitutions in Cu6Sn5

Yang, Y. / Li, Y. / Lu, H. et al. | British Library Online Contents | 2012

Effect of Fe on the cycle life of Cu6Sn5 anodes

Wolfenstine, J. / Campos, S. | British Library Online Contents | 2002

Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5

Mu, D. / Huang, H. / Nogita, K. | British Library Online Contents | 2012