Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes

Mu, D. / Huang, H. / McDonald, S. D. et al. | British Library Online Contents | 2013

Electrochemical deposition of nanodendritic Sn/Cu6Sn5 foam

Jeun, J. H. / Kim, W. S. / Hong, S. H. | British Library Online Contents | 2015

First-principles calculations of Zn substitutions in Cu6Sn5

Yang, Y. / Li, Y. / Lu, H. et al. | British Library Online Contents | 2012

Micromechanical behavior of single-crystalline Cu6Sn5 by picoindentation

Yu, J. J. / Wu, J. Y. / Yu, L. J. et al. | British Library Online Contents | 2017

Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Yang, P. F. / Lai, Y. S. / Jian, S. R. et al. | British Library Online Contents | 2008