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    Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding

    New search for: Park, S. W.
    New search for: Sugahara, T.
    New search for: Hatamura, M.
    New search for: Kagami, N.
    New search for: Sakamoto, S.
    New search for: Nagao, S.
    New search for: Suganuma, K.

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    Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding

    New search for: Park, S. W.
    New search for: Sugahara, T.
    New search for: Hatamura, M.
    New search for: Kagami, N.
    New search for: Sakamoto, S.
    New search for: Nagao, S.
    New search for: Suganuma, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding

    New search for: Park, S. W.
    New search for: Sugahara, T.
    New search for: Hatamura, M.
    New search for: Kagami, N.
    New search for: Sakamoto, S.
    New search for: Nagao, S.
    New search for: Suganuma, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
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    Document information
    Title:

    Surface modification of Cu flakes through Ag precipitation for low-temperature pressureless sintering bonding

    Contributors:

    Park, S. W. (author) / Sugahara, T. (author) / Hatamura, M. (author) / Kagami, N. (author) / Sakamoto, S. (author) / Nagao, S. (author) / Suganuma, K. (author)

    Published in:

    MATERIALS LETTERS ; 151 ; 68-71

    Publication date:

    2015-01-01

    Size:

    4 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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