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    Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper

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    New search for: Bai, Q.
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    Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper

    New search for: Wang, Q.
    New search for: Bai, Q.
    New search for: Chen, J.
    New search for: Guo, Y.
    New search for: Xie, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper

    New search for: Wang, Q.
    New search for: Bai, Q.
    New search for: Chen, J.
    New search for: Guo, Y.
    New search for: Xie, W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper

    Contributors:

    Wang, Q. (author) / Bai, Q. (author) / Chen, J. (author) / Guo, Y. (author) / Xie, W. (author)

    Published in:

    APPLIED SURFACE SCIENCE ; 355 ; 1153-1160

    Publication date:

    2015-01-01

    Size:

    8 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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