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Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper
Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper
Stress-induced formation mechanism of stacking fault tetrahedra in nano-cutting of single crystal copper
Wang, Quanlong (author) / Bai, Qingshun (author) / Chen, Jiaxuan (author) / Guo, Yongbo (author) / Xie, Wenkun (author)
Applied surface science ; 355 ; 1153-1160
2015-01-01
8 pages
Article (Journal)
English
DDC:
620.44
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