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Residual stress within nanoscale metallic multilayer systems during thermal cycling

Economy, D. R. / Cordill, M. J. / Payzant, E. A. / Kennedy, M. S.

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Residual stress within nanoscale metallic multilayer systems during thermal cycling

Economy, D. R. / Cordill, M. J. / Payzant, E. A. / Kennedy, M. S.

Residual stress within nanoscale metallic multilayer systems during thermal cycling

Economy, D. R. / Cordill, M. J. / Payzant, E. A. / Kennedy, M. S.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Residual stress within nanoscale metallic multilayer systems during thermal cycling

Contributors:

Economy, D. R. (author) / Cordill, M. J. (author) / Payzant, E. A. (author) / Kennedy, M. S. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 648 ; 289-298

Publication date:

2015-01-01

Size:

10 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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