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    Residual Stresses and Void Kinetics in AlSiC MMCs during Thermal Cycling

    New search for: Schobel, M.
    New search for: Requena, G.C.
    New search for: Kaminski, H.
    New search for: Degischer, H.P.
    New search for: Buslaps, T.
    New search for: di Michiel, M.

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    Residual Stresses and Void Kinetics in AlSiC MMCs during Thermal Cycling

    New search for: Schobel, M.
    New search for: Requena, G.C.
    New search for: Kaminski, H.
    New search for: Degischer, H.P.
    New search for: Buslaps, T.
    New search for: di Michiel, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Residual Stresses and Void Kinetics in AlSiC MMCs during Thermal Cycling

    New search for: Schobel, M.
    New search for: Requena, G.C.
    New search for: Kaminski, H.
    New search for: Degischer, H.P.
    New search for: Buslaps, T.
    New search for: di Michiel, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Residual Stresses and Void Kinetics in AlSiC MMCs during Thermal Cycling

    Contributors:

    Schobel, M. (author) / Requena, G.C. (author) / Kaminski, H. (author) / Degischer, H.P. (author) / Buslaps, T. (author) / di Michiel, M. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 571/572 ; 413-420

    Publication date:

    2008-01-01

    Size:

    8 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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