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Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics

Park, M. / Baek, S. / Kim, S. / Kim, S. E.

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Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics

Park, M. / Baek, S. / Kim, S. / Kim, S. E.

Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics

Park, M. / Baek, S. / Kim, S. / Kim, S. E.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Argon plasma treatment on Cu surface for Cu bonding in 3D integration and their characteristics

Contributors:

Park, M. (author) / Baek, S. (author) / Kim, S. (author) / Kim, S. E. (author)

Published in:

APPLIED SURFACE SCIENCE ; 324 ; 168-173

Publication date:

2015-01-01

Size:

6 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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