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    Grain boundary sliding in copper and its relation to cavity formation during creep

    New search for: Sandström, R.
    New search for: Wu, R.
    New search for: Hagström, J.

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    Grain boundary sliding in copper and its relation to cavity formation during creep

    New search for: Sandström, R.
    New search for: Wu, R.
    New search for: Hagström, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Grain boundary sliding in copper and its relation to cavity formation during creep

    New search for: Sandström, R.
    New search for: Wu, R.
    New search for: Hagström, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Grain boundary sliding in copper and its relation to cavity formation during creep

    Contributors:

    Sandström, R. (author) / Wu, R. (author) / Hagström, J. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 651 ; 259-268

    Publication date:

    2016-01-01

    Size:

    10 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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