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Grain boundary sliding in copper and its relation to cavity formation during creep
Grain boundary sliding in copper and its relation to cavity formation during creep
Grain boundary sliding in copper and its relation to cavity formation during creep
Sandström, R. (Autor:in) / Wu, R. (Autor:in) / Hagström, J. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 651 ; 259-268
01.01.2016
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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