Mechanical properties and microstructure of rolled and electrodeposited thin copper foil: Fid-Bau Portal

Mechanical properties and microstructure of rolled and electrodeposited thin copper foil

Yin, X. Q. / Peng, L. J. / Kayani, S. / Cheng, L. / Wang, J. W. / Xiao, W. / Wang, L. G. / Huang, G. J.

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Mechanical properties and microstructure of rolled and electrodeposited thin copper foil

Yin, X. Q. / Peng, L. J. / Kayani, S. / Cheng, L. / Wang, J. W. / Xiao, W. / Wang, L. G. / Huang, G. J.

Mechanical properties and microstructure of rolled and electrodeposited thin copper foil

Yin, X. Q. / Peng, L. J. / Kayani, S. / Cheng, L. / Wang, J. W. / Xiao, W. / Wang, L. G. / Huang, G. J.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Mechanical properties and microstructure of rolled and electrodeposited thin copper foil

Contributors:

Yin, X. Q. (author) / Peng, L. J. (author) / Kayani, S. (author) / Cheng, L. (author) / Wang, J. W. (author) / Xiao, W. (author) / Wang, L. G. (author) / Huang, G. J. (author)

Published in:

RARE METALS -BEIJING- ENGLISH EDITION ; 35 ; 909-914

Publication date:

2016-01-01

Size:

6 pages

ISSN:

1001-0521

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669

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