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    Grain boundary character distribution in electroplated nanotwinned copper

    New search for: Ratanaphan, S.
    New search for: Raabe, D.
    New search for: Sarochawikasit, R.
    New search for: Olmsted, D. L.
    New search for: Rohrer, G. S.
    New search for: Tu, K. N.

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    Grain boundary character distribution in electroplated nanotwinned copper

    New search for: Ratanaphan, S.
    New search for: Raabe, D.
    New search for: Sarochawikasit, R.
    New search for: Olmsted, D. L.
    New search for: Rohrer, G. S.
    New search for: Tu, K. N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Grain boundary character distribution in electroplated nanotwinned copper

    New search for: Ratanaphan, S.
    New search for: Raabe, D.
    New search for: Sarochawikasit, R.
    New search for: Olmsted, D. L.
    New search for: Rohrer, G. S.
    New search for: Tu, K. N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Grain boundary character distribution in electroplated nanotwinned copper

    Contributors:

    Ratanaphan, S. (author) / Raabe, D. (author) / Sarochawikasit, R. (author) / Olmsted, D. L. (author) / Rohrer, G. S. (author) / Tu, K. N. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 52 ; 4070-4085

    Publication date:

    2017-01-01

    Size:

    16 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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