Grain growth, stress, and impurities in electroplated copper: Fid-Bau Portal

Grain growth, stress, and impurities in electroplated copper

Brongersma, S. H. / Kerr, E. / Vervoort, I. / Saerens, A. / Maex, K.

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Grain growth, stress, and impurities in electroplated copper

Brongersma, S. H. / Kerr, E. / Vervoort, I. / Saerens, A. / Maex, K.

Grain growth, stress, and impurities in electroplated copper

Brongersma, S. H. / Kerr, E. / Vervoort, I. / Saerens, A. / Maex, K.

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Order at Subito €

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Document information

Title:

Grain growth, stress, and impurities in electroplated copper

Contributors:

Brongersma, S. H. (author) / Kerr, E. (author) / Vervoort, I. (author) / Saerens, A. (author) / Maex, K. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 582-589

Publication date:

2002-01-01

Size:

8 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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