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High copper loading metal organic decomposition paste for printed electronics

Tam, S. K. / Fung, K. Y. / Ng, K. M.

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High copper loading metal organic decomposition paste for printed electronics

Tam, S. K. / Fung, K. Y. / Ng, K. M.

High copper loading metal organic decomposition paste for printed electronics

Tam, S. K. / Fung, K. Y. / Ng, K. M.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

High copper loading metal organic decomposition paste for printed electronics

Contributors:

Tam, S. K. (author) / Fung, K. Y. (author) / Ng, K. M. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 52 ; 5617-5625

Publication date:

2017-01-01

Size:

9 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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