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    Copper pastes using bimodal particles for flexible printed electronics

    New search for: Tam, S. K.
    New search for: Fung, K. Y.
    New search for: Ng, K. M.

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    Copper pastes using bimodal particles for flexible printed electronics

    New search for: Tam, S. K.
    New search for: Fung, K. Y.
    New search for: Ng, K. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Copper pastes using bimodal particles for flexible printed electronics

    New search for: Tam, S. K.
    New search for: Fung, K. Y.
    New search for: Ng, K. M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Copper pastes using bimodal particles for flexible printed electronics

    Contributors:

    Tam, S. K. (author) / Fung, K. Y. (author) / Ng, K. M. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 51 ; 1914-1922

    Publication date:

    2016-01-01

    Size:

    9 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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