Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

Kim, D. G. / Jang, H. S. / Kim, Y. J. et al. | British Library Online Contents | 2005

Dissolution and reprecipitation: a promising route for thermoplastics recycling

Papaspyrides, C. / Swiss Federal Laboratories for Materials Testing and Research (EMPA) | British Library Conference Proceedings | 1997

Synthesis of rutile titania powders: Agglomeration, dissolution, and reprecipitation phenomena

Klein, S. M. / Choi, J. H. / Pine, D. J. et al. | British Library Online Contents | 2003

Reprecipitation behavior in Al-Cu binary alloy after severe plastic deformation-induced dissolution of ' particles

Huang, W. / Liu, Z. / Lin, M. et al. | British Library Online Contents | 2012

Characterizing the formation and growth of intermetallic compound in the solder joint

Lee, Y. G. / Duh, J. G. | British Library Online Contents | 1998