Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

    New search for: Kim, D. G.
    New search for: Jang, H. S.
    New search for: Kim, Y. J.
    New search for: Jung, S. B.
    New search for: Kim, H. S.
    New search for: Park, S.-Y.
    New search for: Hur, B. Y.
    New search for: Lee, S. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

    New search for: Kim, D. G.
    New search for: Jang, H. S.
    New search for: Kim, Y. J.
    New search for: Jung, S. B.
    New search for: Kim, H. S.
    New search for: Park, S.-Y.
    New search for: Hur, B. Y.
    New search for: Lee, S. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

    New search for: Kim, D. G.
    New search for: Jang, H. S.
    New search for: Kim, Y. J.
    New search for: Jung, S. B.
    New search for: Kim, H. S.
    New search for: Park, S.-Y.
    New search for: Hur, B. Y.
    New search for: Lee, S. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

    Contributors:

    Kim, D. G. (author) / Jang, H. S. (author) / Kim, Y. J. (author) / Jung, S. B. (author) / Kim, H. S. / Park, S.-Y. / Hur, B. Y. / Lee, S. W.

    Published in:

    Eco-Materials Processing & Design VI ; 273-276

    MATERIALS SCIENCE FORUM ; 486/487

    Publication date:

    2005-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn-3.0Ag-0.5Cu Solder and Ni-P under Bump Metallurgy

    Kim, D.-G. / Jung, S.-B. | British Library Online Contents | 2005

    Solder Bump Inspection Evaluating new flip chip designs

    Asgari, R. / Romega-Thompson, V. | British Library Online Contents | 2002

    Variable Flip Chip Assembly for High-volume Production Solder Bump and Adhesive Flip Chip Advantages

    Pajonk, J. / Halk, D. R. | British Library Online Contents | 2004

    Effects of substrate metallizations on solder/underbump metallization interfacial reactions in flip-chip packages during thermal aging

    Zhang, F. / Li, M. / Chum, C. C. et al. | British Library Online Contents | 2003

    Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

    Chen, S.-w. / Lin, S.-k. / Jao, J.-m. | British Library Online Contents | 2004

    Back to top