Effect of body defect on mechanical behaviors of Cu nanowire under tension: a molecular dynamics investigation: Fid-Bau Portal

Effect of body defect on mechanical behaviors of Cu nanowire under tension: a molecular dynamics investigation

Qiao, C. / Guo, Y. / Wang, Z. / Zheng, Y. / Zhang, R. / Chen, L. / Chen, Y. L. / Su, W. S. / Jia, Y. / Wang, S.

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Effect of body defect on mechanical behaviors of Cu nanowire under tension: a molecular dynamics investigation

Qiao, C. / Guo, Y. / Wang, Z. / Zheng, Y. / Zhang, R. / Chen, L. / Chen, Y. L. / Su, W. S. / Jia, Y. / Wang, S.

Effect of body defect on mechanical behaviors of Cu nanowire under tension: a molecular dynamics investigation

Qiao, C. / Guo, Y. / Wang, Z. / Zheng, Y. / Zhang, R. / Chen, L. / Chen, Y. L. / Su, W. S. / Jia, Y. / Wang, S.

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Document information

Title:

Effect of body defect on mechanical behaviors of Cu nanowire under tension: a molecular dynamics investigation

Contributors:

Qiao, C. (author) / Guo, Y. (author) / Wang, Z. (author) / Zheng, Y. (author) / Zhang, R. (author) / Chen, L. (author) / Chen, Y. L. (author) / Su, W. S. (author) / Jia, Y. (author) / Wang, S. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 52 ; 13237-13246

Publication date:

2017-01-01

Size:

10 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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